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ABSOLUTE MAXIMUM RATINGS

TPA0212

SLOS284B – NOVEMBER 1999 – REVISED NOVEMBER 2004

TERMINAL FUNCTIONS

TERMINAL

I/O

DESCRIPTION

NAME

NO.

BYPASS

11

Tap to voltage divider for internal mid-supply bias generator

GAIN0

2

I

Bit 0 of gain control

GAIN1

3

I

Bit 1 of gain control

1, 12,

GND

Ground connection for circuitry. Connected to the thermal pad.

13, 24

LHPIN

6

I

Left-channel headphone input, selected when SE/BTL is held high

LIN

10

I

Common left input for fully differential input. AC ground for single-ended inputs.

LLINEIN

5

I

Left-channel line input, selected when SE/BTL is held low

LOUT+

4

O

Left-channel positive output in BTL mode and positive output in SE mode

LOUT-

9

O

Left-channel negative output in BTL mode and high-impedance in SE mode

The input for PC-Beep mode. PC-BEEP is enabled when a > 1.5-V (peak-to-peak) square wave is

PC-BEEP

14

I

input to PC-BEEP.

HP/LINE is the input MUX control input. When the HP/LINE terminal is held high, the headphone inputs

HP/LINE

17

I

(LHPIN or RHPIN [6, 20]) are active. When the HP/LINE terminal is held low, the line inputs (LLINEIN

or RLINEIN [5, 23]) are active.

7, 18

I

Power supply for output stage

RHPIN

20

I

Right-channel headphone input, selected when SE/BTL is held high

RIN

8

I

Common right input for fully differential input. AC ground for single-ended inputs.

RLINEIN

23

I

Right-channel line input, selected when SE/BTL is held low

ROUT+

21

O

Right-channel positive output in BTL mode and positive output in SE mode

ROUT-

16

O

Right-channel negative output in BTL mode and high-impedance in SE mode

SHUTDOWN

22

I

Places entire IC in shutdown mode when held low, except PC-BEEP remains active

SE/BTL

15

I

Hold SE/BTL low for BTL mode and hold high for SE mode.

19

I

performance.

Connect to ground. Must be soldered down in all applications to properly secure the device on the PC

ThermalPAD

board.

UNIT

Supply voltage

6 V

Input voltage

Continuous total power dissipation

Internally limited

(see Dissipation Rating Table)

Operating free-air temperature range

-40

°C to 85°C

Operating junction temperature range,

-40

°C to 150°C

Storage temperature range

-65

°C to 85°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

3