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CS3170 数据表(PDF) 7 Page - Applied Micro Circuits Corporation |
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CS3170 数据表(HTML) 7 Page - Applied Micro Circuits Corporation |
7 / 11 page S3170 – 2.5 Gbps Transimpedance Amplifier AMCC Confidential and Proprietary 7 Revision A – August 12, 2004 Data Sheet DESIGN PROCEDURES Determining Capacitor Values CFILT can be selected using the formula: Low Frequency -3dB cutoff = 1 / [2 π*400 kΩ*(10pF + C FILT)] APPLICATION INFORMATION Filtering Through RBYPASS To reduce the effect of supply voltage noise at the cathode of the photodiode, the cathode connection to VCC should be made through the RBYPASS resistor. The RBYPASS resistor and an external capacitor to ground at the cathode of the photodiode will act as a filter to reduce this noise and dampen any resonance at the cathode of the photodiode. Wire Bonding and Layout information For best performance all GND pads should be connected and the bond wire inductance between the photodiode and the IIN pin should be kept to below 1.5 nH – 2 nH. The back of the die is not metallized and should be con- nected to ground or left electrically unconnected. The outputs OUTP and OUTN should be terminated equally to prevent instabilities. Figures 4 and 5 show differen- tial and single-ended termination. |
类似零件编号 - CS3170 |
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类似说明 - CS3170 |
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