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CAY16-103F2 数据表(PDF) 4 Page - Bourns Electronic Solutions |
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CAY16-103F2 数据表(HTML) 4 Page - Bourns Electronic Solutions |
4 / 4 page Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Cleaning A recommended cleaning method is shown in the following table. Component Placement a. Reduce the mechanical stress to a minimum during and after placing of the unit in order not to damage the terminals and protective coating. b. Misplacement of components may cause solder bridges. Soldering a. Reflow soldering: Recommendation is shown in the following chart. b. Wave soldering: Recommendation according to IEC standards. c. Hand soldering: Don’t touch the protective coating of the part. Solder within 3 seconds when the temperature is over 280 ºC. Cleaning Condition Solvents Dipping Ultrasonic Wave Washing 1 minute maximum Isopropyl alcohol 5 minutes maximum Power: 20 W/L Frequency: 10 to 100 kHz 250 200 150 100 50 0 Preheating Soldering Gradual Cooling 60 sec. min. 10-30 sec. 120 sec. min. Chip Resistor Arrays - Application Note |
类似零件编号 - CAY16-103F2 |
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类似说明 - CAY16-103F2 |
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