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SN74F109D 数据表(PDF) 5 Page - Texas Instruments

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部件名 SN74F109D
功能描述  DUAL J-K POSITIVE-EDGE-TRIGGERED FLIP-FLOPS WITH CLEAR AND PRESET
Download  6 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

SN74F109D 数据表(HTML) 5 Page - Texas Instruments

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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9758001Q2A
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
5962-9758001QEA
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
5962-9758001QFA
ACTIVE
CFP
W
16
1
None
Call TI
Level-NC-NC-NC
JM38510/34102B2A
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
JM38510/34102BEA
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
JM38510/34102BFA
ACTIVE
CFP
W
16
1
None
Call TI
Level-NC-NC-NC
SN74F109D
ACTIVE
SOIC
D
16
40
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74F109DR
ACTIVE
SOIC
D
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74F109N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SNJ54F109FK
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
SNJ54F109J
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
SNJ54F109W
ACTIVE
CFP
W
16
1
None
Call TI
Level-NC-NC-NC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1


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