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HLMP-KB25-L00DD 数据表(PDF) 2 Page - Agilent(Hewlett-Packard) |
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HLMP-KB25-L00DD 数据表(HTML) 2 Page - Agilent(Hewlett-Packard) |
2 / 6 page 2 Part Number Package Viewing Angle Min. Max. HLMP-KB45-A00xx T-1 40 30 – HLMP-DB25-B00xx T-1 3/4 25 40 – Selection Guide Luminous Intensity Iv (mcd) Mechanical Option 00: Bulk 02: Tape & Reel, Straight Leads DD: Ammo Pack Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Minimum Iv Bin Options Please refer to the Iv Bin Table Viewing Angle 25: 25 degrees 45: 40 degrees Color Options B: Blue 462 nm Package Options D: T-1 3/4 (5 mm) K: T-1 (3 mm) Part Numbering System HLMP - x x xx - x x x xx Absolute Maximum Ratings at TA = 25˚C Parameter Blue Units Peak Forward Current 70 mA DC Current[1] 30 mA Reverse Voltage (IR = 100 µA) 5 V Transient Forward Current[2] 350 mA (10 µsec Pulse) LED Junction Temperature 115 ˚C Operating Temperature –20 to +80 ˚C Storage Temperature –30 to +100 ˚C Lead Soldering Temperature 260 °C for 5 seconds [1.6 mm (0.063 in.) from body] Notes: 1. Derate linearly from 50 °C as shown in Figure 6. 2. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and wirebond. It is not recommended that this device be operated at peak currents above the Absolute Maximum Peak Forward Current. |
类似零件编号 - HLMP-KB25-L00DD |
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类似说明 - HLMP-KB25-L00DD |
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