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74F657 数据表(PDF) 6 Page - NXP Semiconductors |
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74F657 数据表(HTML) 6 Page - NXP Semiconductors |
6 / 12 page Philips Semiconductors Product specification 74F657 Octal transceiver with 8-bit parity generator/checker 90 July 30 6 DC ELECTRICAL CHARACTERISTICS (Over recommended operating free-air temperature range unless otherwise noted.) SYMBOL PARAMETER TEST LIMITS UNIT CONDITIONS1 MIN TYP2 MAX All outputs IOH = –3mA4,5 ±10%VCC 2.4 V VCC = MIN, ±5%VCC 2.7 V VOH High-level output voltage B0 – B7, VIL = MAX, IOH = –12mA5 ±10%VCC 2.0 V PARITY, VIH = MIN ±5%VCC 2.0 V ERROR IOH = –15mA4 ±10%VCC 2.0 V ±5%VCC 2.0 V A0 – A7 IOL = 24mA4,5 ±10%VCC 0.35 0.50 V VCC = MIN, ±5%VCC 0.35 0.50 V VOL Low-level output voltage B0 – B7, VIL = MAX, IOL = 48mA4 ±10%VCC 0.38 0.55 V PARITY, VIH = MIN IOL = 48mA5 ±5%VCC 0.42 0.55 V ERROR IOL = 64mA4 ±5%VCC 0.42 0.55 V VIK Input clamp voltage VCC = MIN, II = IIK –0.73 -1.2 V Input current at OE, T/R, ODD/EVEN VCC = 0.0V, VI = 7.0V 100 µA II maximum input voltage A0 – A7 VCC = 5.5V, VI = 5.5V 2 mA B0 – B7 1 mA OOD/EVEN 204 µA IIH High–level input current VCC = MAX, VI = 2.7V 405 µA OE, T/R 404 µA 805 µA IIL Low–level input current OOD/EVEN VCC = MAX, VI = 0.5V –20 µA OE, T/R –40 µA IOZH + IIH Off–state output current, high–level voltage applied A0 – A7, B0 – B7, VCC = MAX, VO = 2.7V 70 µA IOZL + IIL Off–state output current, low–level voltage applied PARITY VCC = MAX, VO = 0.5V –70 µA IOZH Off–state output current, High–level voltage applied ERROR VCC = MAX, VO = 2.7V 50 µA IOZL Off–state output current, low–level voltage applied VCC = MAX, VO = 0.5V –50 µA IOS Short circuit output current3 A0 – A7 VCC = MAX -60 -150 mA B0 – B7 -100 -225 mA ICCH 90 1254 mA 90 1355 mA ICC Supply current (total) ICCL VCC = MAX 106 1504 mA 106 1605 mA ICCZ 98 145 mA Notes to DC electrical characteristics 1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type. 2. All typical values are at VCC = 5V, Tamb = 25°C. 3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence of parameter tests, IOS tests should be performed last. 4. For commercial range. 5. For industrial range. |
类似零件编号 - 74F657 |
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类似说明 - 74F657 |
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