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MC33975EK 数据表(PDF) 5 Page - Freescale Semiconductor, Inc |
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MC33975EK 数据表(HTML) 5 Page - Freescale Semiconductor, Inc |
5 / 32 page Analog Integrated Circuit Device Data Freescale Semiconductor 5 33975 MAXIMUM RATINGS MAXIMUM RATINGS Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these limits may cause malfunction or permanent damage to the device. Rating Symbol Value Unit ELECTRICAL RATINGS VDD Supply Voltage – -0.3 to 7.0 VDC CS, SI, SO, SCLK, INT, AMUX – -0.3 to 7.0 VDC WAKE – -0.3 to 40 VDC VPWR Supply Voltage – -0.3 to 50 VDC Switch Input Voltage Range MC33975 PC339775A – -14 to 38 -14 to 40 VDC Frequency of SPI Operation (VDD = 5.0 V) – 6.0 MHz ESD Voltage (1) Human Body Model (2) Applies to all non-input terminals Machine Model Charge Device Model Corner Terminals Interior Terminals VESD ±4000 ±2500 ±200 750 500 V THERMAL RATINGS Operating Temperature Ambient Junction Case TA TJ TC -40 to 125 -40 to 150 -40 to 125 °C Storage Temperature TSTG -55 to 150 °C Power Dissipation (3) PD 1.7 W Thermal Resistance Junction to Ambient Between the Die and the Exposed Die Pad (4) RθJA RθJC 71 1.2 °C/W Peak Package Reflow Temperature During Solder Mounting (5) TSOLDER 245 °C Notes 1. ESD testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), the Machine Model (CZAP = 200 pF, RZAP = 0 Ω), and the Charge Device Model. 2. All Programmable Switches (SP) and Switch-to-Ground (SG) input terminals when tested individually. 3. Maximum power dissipation at TJ =150°C junction temperature with no heatsink used. 4. Thermal resistance between the die and the exposed die pad. 5. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. |
类似零件编号 - MC33975EK |
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类似说明 - MC33975EK |
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