PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

84032013A

ACTIVE

LCCC

FK

28

1

None

Call TI

Level-NC-NC-NC

8403201KA

OBSOLETE

CFP

W

24

None

Call TI

Call TI

8403201LA

ACTIVE

CDIP

JT

24

1

None

Call TI

Level-NC-NC-NC

SN54ALS873BJT

ACTIVE

CDIP

JT

24

1

None

Call TI

Level-NC-NC-NC

SN74ALS873BDW

ACTIVE

SOIC

DW

24

25

Pb-Free

(RoHS)

CU NIPDAU

Level-2-250C-1 YEAR/

Level-1-235C-UNLIM

SN74ALS873BDWR

ACTIVE

SOIC

DW

24

2000

Pb-Free

(RoHS)

CU NIPDAU

Level-2-250C-1 YEAR/

Level-1-235C-UNLIM

SN74ALS873BNT

ACTIVE

PDIP

NT

24

15

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

SN74ALS873BNT3

OBSOLETE

PDIP

NT

24

None

Call TI

Call TI

SN74AS873ADW

OBSOLETE

SOIC

DW

24

None

Call TI

Call TI

SN74AS873ADWR

OBSOLETE

SOIC

DW

24

None

Call TI

Call TI

SN74AS873ANT

OBSOLETE

PDIP

NT

24

None

Call TI

Call TI

SNJ54ALS873BFK

ACTIVE

LCCC

FK

28

1

None

Call TI

Level-NC-NC-NC

SNJ54ALS873BJT

ACTIVE

CDIP

JT

24

1

None

Call TI

Level-NC-NC-NC

SNJ54AS873AFK

OBSOLETE

LCCC

FK

28

None

Call TI

Call TI

SNJ54AS873AJT

OBSOLETE

CDIP

JT

24

None

Call TI

Call TI

SNJ54AS873AW

OBSOLETE

CFP

W

24

None

Call TI

Call TI

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

PACKAGE OPTION ADDENDUM

www.ti.com

28-Feb-2005

Addendum-Page 1