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CX77304-15 数据表(PDF) 8 Page - Skyworks Solutions Inc. |
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CX77304-15 数据表(HTML) 8 Page - Skyworks Solutions Inc. |
8 / 20 page Package Dimensions and Pin Descriptions CX77304-15 PA Module for Dual-Band GSM850 PCS1900 / GPRS Applications 8 Skyworks Solutions, Inc. 101749A Proprietary Information September 19, 2003 Figure 3. Phone Board Layout Footprint for 9.1 mm x 11.6 mm Package 0.86 1.42 5.00 PIN 1 PIN 16 3.20 9.8 1.905 12.3 STENCIL APERTURE TOP VIEW APPROACH 1 Component Outline Common Ground Pad 0.762 1.32 9.70 1.905 TYP 0.250 12.20 METALLIZATION TOP VIEW Thermal Via Array / 0.3 mm on 0.8 mm pitch Additional vias will improve thermal performance. NOTE: Thermal vias should be tented and filled with solder mask, 30–35 µm Cu plating recommended. o SOLDER MASK OPENING TOP VIEW 12.3 7 4X 0.82 1.91 TYP 9.8 1.42 0.05 ALL AROUND 0.86 4.5 1.42 0.86 1.8 1 0.3 9.8 1.91 12.3 STENCIL APERTURE TOP VIEW APPROACH 2 Component Outline Component Outline Component Outline PIN 1 PIN 16 PIN 1 PIN 16 PIN 1 PIN 16 101749_006 |
类似零件编号 - CX77304-15 |
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类似说明 - CX77304-15 |
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