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TS5A3160DCKRE4 数据表(PDF) 1 Page - Texas Instruments |
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TS5A3160DCKRE4 数据表(HTML) 1 Page - Texas Instruments |
1 / 24 page www.ti.com FEATURES APPLICATIONS 6 DBV OR DCK PACKAGE (TOP VIEW) 1 2 3 4 NO GND NC COM 5 V+ 3 4 5 2 1 YEP OR YZP PACKAGE (BOTTOM VIEW) 6 IN NC GND NO IN V+ COM DESCRIPTION/ORDERING INFORMATION TS5A3160 1- Ω SPDT ANALOG SWITCH 5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER SCDS216 – OCTOBER 2005 • Cell Phones • Isolation in the Powered-Off Mode, V+ = 0 • PDAs • Specified Make-Before-Break Switching • Portable Instrumentation • Low ON-State Resistance (1 Ω) • Audio and Video Signal Routing • Control Inputs Are 5.5-V Tolerant • Low-Voltage Data Acquisition Systems • Low Charge Injection • Communication Circuits • Excellent ON-State Resistance Matching • Modems • Low Total Harmonic Distortion (THD) • Hard Drives • 1.65-V to 5.5-V Single-Supply Operation • Computer Peripherals • Latch-Up Performance Exceeds 100 mA Per • Wireless Terminals and Peripherals JESD 78, Class II • ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) The TS5A3160 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers a low ON-state resistance and an excellent channel-to-channel ON-state resistance matching. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) TS5A3160YEPR 0.23-mm Large Bump – YEP Tape and reel PREVIEW NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP TS5A3160YZPR –40 °C to 85°C (Pb-free) SOT (SOT-23) – DBV Tape and reel TS5A3160DBVR JA8_ SOT (SC-70) – DCK(2) Tape and reel TS5A3160DCKR JA_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
类似零件编号 - TS5A3160DCKRE4 |
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类似说明 - TS5A3160DCKRE4 |
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