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ISL59442IB-T7 数据表(PDF) 6 Page - Intersil Corporation |
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ISL59442IB-T7 数据表(HTML) 6 Page - Intersil Corporation |
6 / 11 page 6 FN7452.2 September 21, 2005 FIGURE 15. HIZ SWITCHING GLITCH VIN = 0V, RS = 25, CL = 23.6pF FIGURE 16. HIZ TRANSIENT RESPONSE VIN = 1V, RS = 25, CL = 23.6pF FIGURE 17. SMALL SIGNAL TRANSIENT RESPONSE FIGURE 18. LARGE SIGNAL TRANSIENT RESPONSE FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Typical Performance Curves VS = ±5V, RL = 500Ω to GND, TA = 25°C, unless otherwise specified. (Continued) 0 0 20ns/DIV VOUT HIZ 0 0 20ns/DIV VOUT HIZ TIME (4ns/DIV) 120 80 40 0 -40 -80 -120 160 -160 CL = 1.6pF RL = 500Ω TIME (4ns/DIV) 2 1.6 1.2 0.8 0.4 0 -0.4 -0.8 2.4 CL = 23.6pF RS = 25Ω RL = 500Ω 1.136W θ JA = 88° C/W SO 14 1.4 1.2 1 0.8 0.6 0.2 0 0 25 50 75 100 150 AMBIENT TEMPERATURE (°C) 125 85 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.4 833mW θ JA =1 20° C/W SO 14 1 0.9 0.8 0.6 0.4 0.1 0 025 50 75 100 150 AMBIENT TEMPERATURE (°C) 125 85 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.2 0.7 0.3 0.5 ISL59442 |
类似零件编号 - ISL59442IB-T7 |
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类似说明 - ISL59442IB-T7 |
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