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MC100E141 数据表(PDF) 2 Page - ON Semiconductor |
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MC100E141 数据表(HTML) 2 Page - ON Semiconductor |
2 / 4 page MC10E141 MC100E141 MOTOROLA ECLinPS and ECLinPS Lite DL140 — Rev 4 2–2 LOGIC DIAGRAM BITS 1 – 6 DL Q7 D Q R D Q R D Q R DR D0 SEL1 SEL0 CLK MR Q0 D Q D7 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0 °C 25 °C 85 °C Symbol Characteristic min typ max min typ max min typ max Unit Condition IIH Input HIGH Current 150 150 150 µA IEE Power Supply Current mA 10E 131 181 131 181 131 181 100E 131 181 131 181 151 181 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0 °C 25 °C 85 °C Symbol Characteristic min typ max min typ max min typ max Unit Condition fSHIFT Max. Shift Frequency 700 900 700 900 700 900 MH z tPLH Propagation Delay To Output ps tPHL Clk 625 750 975 625 750 975 625 750 975 MR 600 725 975 600 725 975 600 725 975 ts Setup Time ps D 175 25 175 25 175 25 SEL0 350 200 350 200 350 200 SEL1 300 150 300 150 300 150 th Hold Time ps D 200 – 25 200 – 25 200 – 25 SEL0 100 – 200 100 – 200 100 – 200 SEL1 100 –150 100 –150 100 –150 tRR Reset Recovery Time 900 700 900 700 900 700 ps tPW Minimum Pulse Width ps Clk, MR 400 400 400 tSKEW Within-Device Skew 60 60 60 ps 1 tr Rise/Fall Times ps tf 20 - 80% 300 525 800 300 525 800 300 525 800 1. Within-device skew is defined as identical transitions on similar paths through a device. |
类似零件编号 - MC100E141 |
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类似说明 - MC100E141 |
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