10 / 23 page
Rev: 1.04 2/2001
10/23
© 2000, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Preliminary
GS82032T/Q-150/138/133/117/100/66
Note: This parameter is sample tested.
Notes:
1. Junction temperature is a function of SRAM power dissipation, package thermal resistance, mounting board temperature, ambient.
Temperature air flow, board density, and PCB thermal resistance.
2. SCMI G-38-87.
3. Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1.
4. For x18 configuration, consult factory.
Capacitance
(TA = 25
oC, f = 1 MHZ, V
DD = 3.3 V)
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
Control Input Capacitance
CI
VDD = 3.3 V
3
4
pF
Input Capacitance
CIN
VIN = 0 V
4
5
pF
Output Capacitance
COUT
VOUT = 0 V
6
7
pF
Package Thermal Characteristics
Rating
Layer Board
Symbol
TQFP Max
QFP Max
Unit
Notes
Junction to Ambient (at 200 lfm)
single
RΘJA
40
TBD
°C/W
1,2,4
Junction to Ambient (at 200 lfm)
four
RΘJA
24
TBD
°C/W
1,2,4
Junction to Case (TOP)
RΘJC
9
TBD
°C/W
3,4
20% tKC
VSS-2.0V
50%
VSS
VIH
Undershoot Measurement and Timing
Overshoot Measurement and Timing
20% tKC
VDD+-2.0V
50%
VDD
VIL