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数据搜索系统，热门电子元器件搜索 |
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HCPL-181-00BE 数据表(PDF) 2 Page - Agilent(Hewlett-Packard) |
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HCPL-181-00BE 数据表(HTML) 2 Page - Agilent(Hewlett-Packard) |
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2 / 6 page  2 Package Outline Drawings HCPL-181-000E HCPL-181-060E Solder Reflow Temperature Profile 1) One-time soldering reflow is recommended within the condition of temperature and time profile shown at right. 2) When using another soldering method such as infrared ray lamp, the temperature may rise partially in the mold of the device. Keep the temperature on the package of the device within the condition of (1) above. 30 seconds 60 ~ 150 sec 90 sec 60 sec 60 sec 25 °C 150 °C 200 °C 250 °C 260 °C (Peak Temperature) 217 °C Time (sec) DIMENSIONS IN MILLIMETERS. 4.40 ± 0.2 3.60 ± 0.3 2.00 ± 0.2 5.30 ± 0.3 0.2 ± 0.05 7.00 0.40 ± 0.1 0.10 ± 0.1 181 YW W 2.54 ± 0.25 DATE CODE *1 RANK *2 LEAD FREE + 0.2 – 0.7 DIMENSIONS IN MILLIMETERS. 4.40 ± 0.2 3.60 ± 0.3 2.00 ± 0.2 5.30 ± 0.3 0.2 ± 0.05 7.00 0.40 ± 0.1 0.10 ± 0.1 181 V YW W 2.54 ± 0.25 DATE CODE *1 RANK *2 LEAD FREE + 0.2 – 0.7 |
类似零件编号 - HCPL-181-00BE |
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类似说明 - HCPL-181-00BE |
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