数据搜索系统,热门电子元器件搜索 |
|
TS5A23167YEPR 数据表(PDF) 1 Page - Texas Instruments |
|
TS5A23167YEPR 数据表(HTML) 1 Page - Texas Instruments |
1 / 25 page www.ti.com FEATURES APPLICATIONS SSOP OR VSSOP PACKAGE (TOP VIEW) 1 2 3 4 8 7 6 5 NC1 COM1 IN2 GND COM2 IN1 V+ NC2 YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) GND IN1 COM2 V+ 2 3 4 8 7 5 6 IN2 COM1 NC1 NC2 1 DESCRIPTION/ORDERING INFORMATION TS5A23167 0.9- Ω DUAL SPST ANALOG SWITCH 5-V/3.3-V 2-CHANNEL ANALOG SWITCH SCDS195 – MAY 2005 • Cell Phones • Isolation in Powered-Off Mode, V+ = 0 • PDAs • Low ON-State Resistance (0.9 Ω) • Portable Instrumentation • Control Inputs Are 5.5-V Tolerant • Audio and Video Signal Routing • Low Charge Injection • Low-Voltage Data Acquisition Systems • Low Total Harmonic Distortion (THD) • Communication Circuits • 1.65-V to 5.5-V Single-Supply Operation • Modems • Latch-Up Performance Exceeds 100 mA Per • Hard Drives JESD 78, Class II • Computer Peripherals • ESD Performance Tested Per JESD 22 • Wireless Terminals and Peripherals – 2000-V Human-Body Model(A114-B, Class II) – 1000-V Charged-Device Model (C101) The TS5A23167 is a dual single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers a low ON-state resistance. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) Tape and reel TS5A23167YEPR PACKAGE PREVIEW 0.23-mm Large Bump – YEP NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP Tape and reel TS5A23167YZPR PACKAGE PREVIEW –40 °C to 85°C (Pb-free) SSOP – DCT Tape and reel TS5A23167DCTR PACKAGE PREVIEW VSSOP – DCU (Pb-free) Tape and reel TS5A23167DCUR JAP_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The acutal top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
类似零件编号 - TS5A23167YEPR |
|
类似说明 - TS5A23167YEPR |
|
|
链接网址 |
隐私政策 |
ALLDATASHEETCN.COM |
ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |