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LTM4676A 数据表(PDF) 65 Page - Linear Technology

部件名 LTM4676A
功能描述  Dual 13A or Single 26A 關Module Regulator with Digital Power System Management
Download  136 Pages
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制造商  LINER [Linear Technology]
网页  http://www.linear.com
标志 LINER - Linear Technology

LTM4676A 数据表(HTML) 65 Page - Linear Technology

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LTM4676A
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4676afa
For more information www.linear.com/LTM4676A
applicaTions inForMaTion
It is recommended that all command writes (write byte,
write word, etc.) be preceded with a polling loop to avoid
the extra complexity of dealing with busy behavior and
unwanted ALERT notification. A simple way to achieve this
is by creating SAFE_WRITE_BYTE() and SAFE_WRITE_
WORD()subroutines.Theabovepollingmechanismallows
one’s software to remain clean and simple while robustly
communicating with the part. For a detailed discussion
of these topics and other special cases please refer to
the application note section located at www.linear.com/
designtools/app_notes.
When communicating using bus speeds at or below
100kHz, the polling mechanism shown here provides a
simplesolutionthatensuresrobustcommunicationwithout
clock stretching. At bus speeds in excess of 100kHz, it is
strongly recommended that the part be configured to en-
able clock stretching. This requires a PMBus master that
supports clock stretching. System software that detects
and properly recovers from the standard PMBus NACK/
BUSY faults as described in the PMBus Specification v1.2,
Part II, Section 10.8.7 is required to communicate above
100kHz without clock stretching. Clock stretching will not
extend the PMBus speed beyond the specified 400kHz.
THERMAL CONSIDERATIONS AND
OUTPUT CURRENT DERATING
The thermal resistances reported in the Pin Configuration
section of this data sheet are consistent with those pa-
rameters defined by JESD51-12 and are intended for use
with finite element analysis (FEA) software modeling tools
that leverage the outcome of thermal modeling, simula-
tion, and correlation to hardware evaluation performed on
a µModule package mounted to a hardware test board.
The motivation for providing these thermal coefficients is
found in JESD51-12 (“Guidelines for Reporting and Using
Electronic Package Thermal Information”).
Many designers may opt to use laboratory equipment
and a test vehicle such as the demo board to predict the
µModule regulator’s thermal performance in their appli-
cation at various electrical and environmental operating
conditions to compliment any FEA activities. Without FEA
software, the thermal resistances reported in the Pin Con-
figuration section are, in and of themselves, not relevant to
providing guidance of thermal performance; instead, the
derating curves provided in this data sheet can be used
in a manner that yields insight and guidance pertaining to
one’s application-usage, and can be adapted to correlate
thermal performance to one’s own application.
The Pin Configuration section gives four thermal coeffi-
cients explicitly defined in JESD51-12; these coefficients
are quoted or paraphrased below:
1 θJA, the thermal resistance from junction to ambi-
ent, is the natural convection junction-to-ambient
air thermal resistance measured in a one cubic foot
sealed enclosure. This environment is sometimes
referred to as “still air” although natural convection
causes the air to move. This value is determined with
the part mounted to a JESD51-9 defined test board,
which does not reflect an actual application or viable
operating condition.
2 θJCbottom, the thermal resistance from junction to the
bottom of the product case, is determined with all of
the component power dissipation flowing through
the bottom of the package. In the typical µModule
regulator, the bulk of the heat flows out the bottom
of the package, but there is always heat flow out into
the ambient environment. As a result, this thermal
resistance value may be useful for comparing pack-
ages but the test conditions don’t generally match the
user’s application.
3 θJCtop, the thermal resistance from junction to top of
the product case, is determined with nearly all of the
component power dissipation flowing through the top
of the package. As the electrical connections of the
typical µModule regulator are on the bottom of the
package, it is rare for an application to operate such
that most of the heat flows from the junction to the
top of the part. As in the case of θJCbottom, this value
may be useful for comparing packages but the test
conditionsdon’tgenerallymatchtheuser’sapplication.
4 θJB,thethermalresistancefromjunctiontotheprinted
circuit board, is the junction-to-board thermal resis-
tance where almost all of the heat flows through the
bottom of the µModule regulator and into the board,
and is really the sum of the θJCbottom and the thermal


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