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AM29DS323DB110WMI 数据表(PDF) 4 Page - Advanced Micro Devices |
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AM29DS323DB110WMI 数据表(HTML) 4 Page - Advanced Micro Devices |
4 / 54 page Am29DS323D 3 P R E L I M I NARY TABLE OF CONTENTS Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5 Special Handling Instructions for FBGA Package .................... 6 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8 Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9 Table 1. Am29DS323D Device Bus Operations ...............................9 Word/Byte Configuration .......................................................... 9 Requirements for Reading Array Data ..................................... 9 Writing Commands/Command Sequences ............................ 10 Accelerated Program Operation ......................................................10 Autoselect Functions .......................................................................10 Simultaneous Read/Write Operations with Zero Latency ....... 10 Standby Mode ........................................................................ 10 Automatic Sleep Mode ........................................................... 10 RESET#: Hardware Reset Pin ............................................... 11 Output Disable Mode .............................................................. 11 Table 2. Am29DS323D Device Bank Divisions ...............................11 Table 3. Top Boot Sector Addresses (Am29DS32xDT) ..................12 Table 4. SecSi ™ Sector Addresses for Top Boot Devices ............. 13 Table 5. Bottom Boot Sector Addresses (Am29DS32xDB) ............14 Table 6. SecSi ™ Sector Addresses for Bottom Boot Devices ....... 15 Autoselect Mode ..................................................................... 16 Table 7. Am29DS323D Autoselect Codes (High Voltage Method) 16 Sector/Sector Block Protection and Unprotection .................. 17 Table 8. Top Boot Sector/Sector Block Addresses for Protection/Unprotection .............................................................17 Table 9. Bottom Boot Sector/Sector Block Addresses for Protection/Unprotection ...........................................17 Write Protect (WP#) ................................................................ 18 Temporary Sector/Sector Block Unprotect ............................. 18 Figure 1. Temporary Sector Unprotect Operation........................... 18 Figure 2. In-System Sector/Sector Block Protect and Unprotect Algorithms................................................................ 19 SecSi ™ (Secured Silicon) Sector Flash Memory Region ....... 20 Hardware Data Protection ...................................................... 20 Low VCC Write Inhibit .....................................................................20 Write Pulse “Glitch” Protection ........................................................21 Logical Inhibit ..................................................................................21 Power-Up Write Inhibit ....................................................................21 Common Flash Memory Interface (CFI) . . . . . . . 21 Table 10. CFI Query Identification String ........................................ 21 Table 11. System Interface String................................................... 22 Table 12. Device Geometry Definition ............................................ 22 Table 13. Primary Vendor-Specific Extended Query ...................... 23 Command Definitions . . . . . . . . . . . . . . . . . . . . . . 24 Reading Array Data ................................................................ 24 Reset Command ..................................................................... 24 Autoselect Command Sequence ............................................ 24 Enter SecSi TM Sector/Exit SecSi Sector Command Sequence .............................................................. 25 Byte/Word Program Command Sequence ............................. 25 Unlock Bypass Command Sequence ..............................................25 Figure 3. Program Operation .......................................................... 26 Chip Erase Command Sequence ........................................... 26 Sector Erase Command Sequence ........................................ 26 Erase Suspend/Erase Resume Commands ........................... 27 Figure 4. Erase Operation.............................................................. 27 Command Definitions ............................................................. 28 Table 14. Am29DS323D Command Definitions.............................. 28 Write Operation Status . . . . . . . . . . . . . . . . . . . . 29 DQ7: Data# Polling ................................................................. 29 Figure 5. Data# Polling Algorithm .................................................. 29 RY/BY#: Ready/Busy# ............................................................ 30 DQ6: Toggle Bit I .................................................................... 30 Figure 6. Toggle Bit Algorithm........................................................ 30 DQ2: Toggle Bit II ................................................................... 31 Reading Toggle Bits DQ6/DQ2 ............................................... 31 DQ5: Exceeded Timing Limits ................................................ 31 DQ3: Sector Erase Timer ....................................................... 31 Table 15. Write Operation Status ................................................... 32 Absolute Maximum Ratings . . . . . . . . . . . . . . . . 33 Figure 7. Maximum Negative Overshoot Waveform ..................... 33 Figure 8. Maximum Positive Overshoot Waveform ....................... 33 Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 33 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 34 Figure 9. I CC1 Current vs. Time (Showing Active and Automatic Sleep Currents) ............................................................. 35 Figure 10. Typical I CC1 vs. Frequency ............................................ 35 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Figure 11. Test Setup.................................................................... 36 Table 16. Test Specifications ......................................................... 36 Figure 12. Input Waveforms and Measurement Levels ................. 36 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 13. Read Operation Timings ............................................... 37 Figure 14. Reset Timings ............................................................... 38 Word/Byte Configuration (BYTE#) .......................................... 39 Figure 15. BYTE# Timings for Read Operations............................ 39 Figure 16. BYTE# Timings for Write Operations............................ 39 Erase and Program Operations .............................................. 40 Figure 17. Program Operation Timings.......................................... 41 Figure 18. Accelerated Program Timing Diagram .......................... 41 Figure 19. Chip/Sector Erase Operation Timings .......................... 42 Figure 20. Back-to-back Read/Write Cycle Timings ...................... 43 Figure 21. Data# Polling Timings (During Embedded Algorithms). 44 Figure 22. Toggle Bit Timings (During Embedded Algorithms)...... 45 Figure 23. DQ2 vs. DQ6................................................................. 45 Figure 24. Temporary Sector/Sector Block Unprotect Timing Diagram ............................................................. 46 Figure 25. Sector/Sector Block Protect/Unprotect Timing Diagram 47 Figure 26. Alternate CE# Controlled Write (Erase/Program) Operation Timings .............................................. 49 Erase And Programming Performance . . . . . . . 50 Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 50 Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 FBD048—48-ball Fine-Pitch Ball Grid Array (FBGA) 6 x 12 mm package ................................................................ 51 TS 048—48-Pin Standard TSOP ............................................ 52 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 53 Revision A (December 1, 1999) .............................................. 53 Publication Number 23480, Revision A (January 25, 2000) ... 53 Revision A+1 (June 16, 2000) ................................................ 53 Revision A+2 (November 1, 2000) ......................................... 53 Revision A+3 (November 22, 2000) ....................................... 53 |
类似零件编号 - AM29DS323DB110WMI |
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类似说明 - AM29DS323DB110WMI |
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